Product Overview
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Features: * Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solder ability issues associated with the higher temperature requirements to process lead-free BGA packages. * Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Features: * Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solder ability issues associated with the higher temperature requirements to process lead-free BGA packages. * Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.
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